Good insulation, soft, high thermal conductivity, low tensile stress, various processing possibilities.
Low electromagnetic loss, no water absorption, high heat resistance, high stability and low fluctuation, replacing the soft board of PI base material.
【提案】開発アイディアシート
Visible light type Ocdecomposition film
High bonding strength, IPX8 waterproof, shock buffering, anti-warping, no base material for 3D surface bonding, resistant to curry/coke/sweat.
good optical performance, acid-free, strong adhesive force and excellent reliability.
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